The synthetic diamond resin cutting sheet has the characteristics of small grinding force, small grinding heat, good self-sharpness and high grinding efficiency, and is widely used for grinding of hard alloy and titanium alloy. It is estimated that approximately 60% of the world's abrasive grade diamonds are currently used in the manufacture of resin bond cutting sheets. However, in the process of grinding, the synthetic diamond resin cutting sheet is prone to premature detachment of the abrasive grains, that is, many abrasive grains fall off on the surface of the 125*1*22 EN12413 cutting disc to leave voids. Under normal circumstances, only about 30% of the abrasive grains of each cutting piece participate in normal grinding, and many of them are prematurely falling off. Therefore, this phenomenon will inevitably affect the grinding ratio of the cutting piece. 1. Analysis of wear characteristics of cutting sheets In order to improve the grinding ratio of the cutting piece, we must discuss the wear mechanism of the cutting piece. The wear process of synthetic diamond cutting discs in grinding is complicated and there are many types of wear. There are mechanical, adhesive, friction, diffusion, chemical, thermal effects, etc., but the main forms are as follows: (1) Due to the poor combination of the diamond abrasive grains and the binder, the diamond abrasive grains fall off prematurely under the action of the grinding force. (2) The physical and mechanical properties of the bonding agent are changed due to the generation of grinding heat, resulting in a decrease in the strength of the bonding agent, which causes the cutting piece to wear. (3) Diamond resin cutting discs generally use RVD grade abrasives. These diamond abrasive discs have more needle-like shapes. Under the action of grinding force, crystal cracking is easy to occur, which causes the cutting disc to wear. (4) The interaction between the diamond crystal face and the material to be processed causes micro-wear to occur at the working end of the diamond abrasive grain. Sometimes, the surface of the diamond is slightly graphitized under the action of the grinding force, which causes the cutting piece to wear. Through the above analysis and observation of the surface morphology of the resin bond diamond cutting piece after grinding, it was found that there are many holes left after the diamond is detached. It is concluded that the combination of the abrasive particles and the binder is too poor, which is the main reason for the premature shedding of the diamond abrasive and the low grinding ratio of the flat cutting disc on sale. In this paper, the coupling agent is used instead of the wetting agent to carry out experimental research, and to find a way to reduce the premature shedding of diamond abrasive and improve the grinding ratio of resin bond diamond cutting piece.