The ceramic bond diamond cutting disc has a high modulus of elasticity and a low fracture toughness, and its bonding strength is higher than that of the 125*1*22 EN12413 cutting disc, and the self-sharpness is superior to the metal bond diamond cutting disc. Ceramic bond diamond cutting discs have been widely used in the processing of composite sheets, hard alloys, glass, ceramics and other materials in recent years, and are hot topics at home and abroad. Russia and other Eastern European countries have developed a ceramic bond diamond cutting disc hot press forming process to reduce the oxidation phenomenon of diamond cutting discs during high temperature sintering. The advantage of this process is that the sintering temperature is low, the holding time is short, the thermal damage of the diamond is small, and the overall performance of the cutting disk after sintering is greatly improved. Japan’s Hashimoto has proposed the use of MgO, K20, B203, SiO2, Na20, Al203, etc. as raw materials to prepare ceramic binders. Under an inert atmosphere, the temperature is 680 ° C, and the temperature is kept for 4-5 hours to prepare low temperature ceramics. Bonding diamond cutting disc, which can be used for grinding of engineering ceramics and ferrite, and has excellent grinding performance. Japan's Noritake Company added Zn0 to the R20-B203-Al203-SiO2 based glass based binder to prepare a glass-ceramic bond diamond cutting disc. The mechanical properties of the glass-ceramic binder in the flat cutting disc on sale are good. Diamond particles have a large holding power. The University of Tokyo, Japan, developed a ceramic bond cutting disc with micronized diamond and cubic boron nitride as abrasives using sol-gel technology to produce nanometer-grade products. Tyrolit of Austria and Norton of the United States use Li20-Al203-Si02 glass-ceramic as a binder, sintering temperature is 800-900 °C, and special heat treatment process is applied to the sintered abrasive tool. The glass bond has strong grip on diamond abrasives and has been successfully applied to the sharpening of polycrystalline diamond tools. Germany's KrebsKiedel uses De Beers' ABN800 as an abrasive to prepare a new type of atmospheric hole ceramic cutting disc. This new type of ceramic cutting disc can reduce the amount of binder and realize the structure by controlling the formation of pores and synthetic pores. The purpose of regular arrangement of abrasive grains. Russia has developed a new type of closed-mouth multi-porous ceramic cutting disc. This new ceramic cutting disc uses a non-flammable foaming agent as a pore-forming agent, and uses SiC and Al203 as abrasive grains, opening up a new way for the preparation process of green cutting discs. It can be used to process heat-resistant steel, silver alloy, bonfire steel, magnetic materials, etc. WINTHERTHUR, Switzerland, produces ceramic cutting discs, ceramic bond CBN cutting discs and microcrystalline sintered ceramic abrasive cutting discs. These cutting discs are mainly used for precision grinding, such as atmospheric holes. Feed ceramic cutting discs can be used for grinding of turbine blades, and precision gears can be machined by barreling, partial barreling and profile grinding. Saint-Gobain of France developed a Vortex technology to prepare a new ceramic CBN cutting disc, and also used Carbon Cool technology to prepare a new type of porous open-cell ceramic cutting disc.